|
 粉末注射成形电子封装材料的性能
Properties of PIM Electronic Package
Parts
|
Materials
|
CTE
(ppm/K)
|
Thermal
Conductivity
(W/mK)
|
Electric
Conductivity
(%IACS)
|
Densities
(g/cm3)
|
|
W-Cu
Alloy
|
6.5-7.2
|
165-180
|
31-35
|
16.1-16.4
|
|
Al/SiCp
Composites
|
4-12
|
120-220
|
-
|
2.0-3.1
|
|
KOVAR
Alloy
|
6.2-7.2
|
15-22
|
-
|
8.15-8.19
|
|
AIN
Ceramic
|
<6
|
150-200
|
-
|
3.26~3.30
|
电子封装产品（图片-6A，6B）
|
